BG6 Series (M.2)

2026-02-16 12:28:51

KIOXIA BG6 Series (M.2)

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Key Features

Key Applications

Specifications

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Client NVMe™ SSD

KIOXIA BG6 Series is a line-up of compact form factor NVMe™ SSDs with capacities up to 2,048 GB, and leverages a PCIe® 4.0, NVMe™ 1.4c specification compliant interface and KIOXIA BiCS FLASH™ generation 6 TLC flash memory*. With higher bandwidth, improved flash management and Host Memory Buffer (HMB) technology, the BG6 Series SSDs deliver very high read performance for compact form factor SSDs of up to 6,000 MB/s (sequential read) and up to 900K IOPS (random read).

KIOXIA BG6 Series SSDs are available in capacities of 256 GB, 512 GB, 1,024 GB and 2,048 GB in M.2 Type 2230 and Type 2280 module form factors, making them suitable for thin and light system designs, such as ultra-thin PCs. The BG6 Series offers a Self-Encrypting Drive (SED) model option, supporting TCG Opal Version 2.01.

KIOXIA BiCS FLASH™ generation 5 TLC flash memory for 256 GB and 512 GB capacity BG6 SSDs

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Product Brief (PDF: 122KB)

Key Features

KIOXIA BiCS FLASH™ generation 6 TLC flash memory (KIOXIA BiCS FLASH™ generation 5 TLC flash memory for 256 GB and 512 GB)

PCIe® 4.0, NVMe™ 1.4c specification compliant

Capacities up to 2,048 GB

M.2 Type 2230 and Type 2280 single-sided form factors

TCG Opal 2.01 SED option

Key Applications

Ultra-mobile PCs

2-in-1 notebook PCs

Application

Specifications

M.2 Type 2230 module form factor

* 表格可以水平滚动。

Base Model NumberKBG60ZNS2T04KBG60ZNS1T02KBG60ZNS512GKBG60ZNS256G

SED Model NumberKBG6AZNS2T04KBG6AZNS1T02KBG6AZNS512GKBG6AZNS256G

Capacity2,048 GB1,024 GB512 GB256 GB

Basic Specifications

Form FactorM.2 2230-S3 Single-sidedM.2 2230-S2 Single-sided

lnterfacePCIe® 4.0, NVMe™ 1.4c

Maximum Interface Speed64 GT/s (PCIe® Gen4 x4)

Flash Memory TypeBiCS FLASH™ TLC

Performance (Up to)

Sequential Read6,000 MB/s4,800 MB/s4,400 MB/s

Sequential Write5,300 MB/s5,000 MB/s4,000 MB/s3,000 MB/s

Random Read900K IOPS650K IOPS350K IOPS

Random Write900K IOPS850K IOPS700K IOPS

Power Requirements

Supply Voltage3.3 V ± 5 %

Power Consumption (Active)4.4 W typ.4.3 W typ.4.7 W typ.4.3 W typ.

Power Consumption (L1.2 mode)3.0 mW typ.

Reliability

MTTF1,500,000 hours

TBW1,200600300150

Dimensions

Thickness2.38 mm Max2.23 mm Max

Width22 ｍｍ ± 0.15 mm

Length30 ｍｍ ± 0.15 mm

Weight3.0 g Max2.9 g Max2.8 g Max2.7 g Max

Environmental

Temperature (Operating)0 ℃ to 85 ℃

Temperature (Non-operating)-40 ℃ to 85 ℃

Humidity (Operating)0 % to 90 % R.H.

Vibration (Operating)196 m/s2 { 20 Grms } ( 20 to 2,000 Hz )

Shock (Operating)14.7 km/s2 { 1,500 G } ( 0.5 ms )

M.2 Type 2280 module form factor

* 表格可以水平滚动。

Base Model NumberKBG60ZNV2T04KBG60ZNV1T02KBG60ZNV512GKBG60ZNV256G

SED Model NumberKBG6AZNV2T04KBG6AZNV1T02KBG6AZNV512GKBG6AZNV256G

Capacity2,048 GB1,024 GB512 GB256 GB

Basic Specifications

Form FactorM.2 2280-S3 Single-sidedM.2 2280-S2 Single-sided

lnterfacePCIe® 4.0, NVMe™ 1.4c

Maximum Interface Speed64 GT/s (PCIe® Gen4 x4)

Flash Memory TypeBiCS FLASH™ TLC

Performance (Up to)

Sequential Read6,000 MB/s4,800 MB/s4,400 MB/s

Sequential Write5,300 MB/s5,000 MB/s4,000 MB/s3,000 MB/s

Random Read900K IOPS650K IOPS350K IOPS

Random Write900K IOPS850K IOPS700K IOPS

Power Requirements

Supply Voltage3.3 V ± 5 %

Power Consumption (Active)4.4 W typ.4.3 W typ.4.7 W typ.4.3 W typ.

Power Consumption (L1.2 mode)3.0 mW typ.

Reliability

MTTF1,500,000 hours

TBW1,200600300150

Dimensions

Thickness2.38 mm Max2.23 mm Max

Width22 ｍｍ ± 0.15 mm

Length80 ｍｍ ± 0.15 mm

Weight6.0 g Max5.9 g Max5.8 g Max5.7 g Max

Environmental

Temperature (Operating)0 ℃ to 85 ℃

Temperature (Non-operating)-40 ℃ to 85 ℃

Humidity (Operating)0 % to 90 % R.H.

Vibration (Operating)196 m/s2 { 20 Grms } ( 20 to 2,000 Hz )

Shock (Operating)14.7 km/s2 { 1,500 G } ( 0.5 ms )

Product image may represent a design model.

Availability of the SED model line-up may vary by region.

Definition of capacity: KIOXIA Corporation defines a megabyte (MB) as 1,000,000 bytes, a gigabyte (GB) as 1,000,000,000 bytes and a terabyte (TB) as 1,000,000,000,000 bytes. A computer operating system, however, reports storage capacity using powers of 2 for the definition of 1 GB = 2^30 = 1,073,741,824 bytes and therefore shows less storage capacity. Available storage capacity (including examples of various media files) will vary based on file size, formatting, settings, software and operating system, such as Microsoft Operating System and/or pre-installed software applications, or media content. Actual formatted capacity may vary.

IOPS: Input Output Per Second (or the number of I/O operations per second).

TBW: Terabytes Written. The number of terabytes that may be written to the SSD for the specified lifetime.

Read and write speed, tested on the state of "Host Memory Buffer (HMB) = On", may vary depending on the host device, read and write conditions, and file size.

Read and write speed may vary depending on various factors such as host devices, software (drivers, OS etc.), and read/write conditions.

MTTF (Mean Time to Failure) is not a guarantee or estimate of product life; it is a statistical value related to mean failure rates for a large number of products which may not accurately reflect actual operation. Actual operating life of the product may be different from the MTTF.

PCIe is a registered trademark of PCI-SIG.

NVMe is a registered or unregistered mark of NVM Express, Inc. in the United States and other countries.

Other company names, product names, and service names may be trademarks of third-party companies.

All information provided here is subject to change without prior notice.

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